Inventor · name-matched record
CHENG CHUNG-LIANG
11 granted patents·2 pending applications·0 citations·filing 2021–2025
78Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
13 records- 0190US2026082894A1Field effect transistor with source/drain via and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0286US12581725B2Gate structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 17, 2026·0 cites·20 claims
- 0381US12550353B2Gate capping structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0478US2026075340A1Multi-wafer stacked cmos image sensor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0572US12564024B2Semiconductor arrangement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
- 0660US12527238B2Resistive random access memory device with improved bottom electrodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·13 claims
- 0759US12563822B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 24, 2026·0 cites·20 claims
- 0855US12584801B2Semiconductor device and method of determining temperature of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
- 0954US12581923B2Method for removing edge of substrate in semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 17, 2026·0 cites·20 claims
- 1053US12568775B2Method for forming a memory device at a backside of a wafer substrate, and memory cell including a memory device at a backside of a wafer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 3, 2026·0 cites·20 claims
- 1153US12568706B2Semiconductor device including image sensor and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 3, 2026·0 cites·18 claims
- 1253US12567462B2RRAM device as physical unclonable function device and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 3, 2026·0 cites·20 claims
- 1346US12581876B2Semiconductor device including work function layer doped with barrier elements and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 17, 2026·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when CHENG CHUNG-LIANG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →