Inventor · name-matched record

CHENG MING-DA

6 granted patents·3 pending applications·0 citations·filing 2021–2025

67Inventor score

Files withTAIWAN SEMICONDUCTOR MFG CO LTD9

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

9 records

0194US2026068689A1Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0292US2026018462A1Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0388US2026076216A1Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0483US12543552B2Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
0583US12532789B2Package structure with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 20, 2026·0 cites·20 claims
0679US12559362B2Micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
0777US12550769B2Method for forming a package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
0870US12598995B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 7, 2026·0 cites·20 claims
0969US12519080B2Systems for fluxless bonding using an atmospheric pressure plasma and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims

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Identity basis: exact name match across USPTO filings. How scoring works →