Inventor · name-matched record
CHEW CHEE HIONG
1 granted patent·2 pending applications·0 citations·filing 2023–2025
14Inventor score
Technology areasH10W
Files withSEMICONDUCTOR COMPONENTS IND LLC3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0190US2026018417A1Silicon-on-insulator die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0273US12525519B2Semiconductor package with guide pinSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jan 13, 2026·0 cites·20 claims
- 0361US2026052989A1Mechanisms for dual coupling a semiconductor package assembly to a componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →