Inventor · name-matched record
CHI YUAN-HSIN
2 granted patents·1 pending application·0 citations·filing 2023–2025
28Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0189US2026096373A1Semiconductor substrate bonding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0281US12518980B2Semiconductor substrate bonding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·20 claims
- 0376US12562347B2Connect structure for semiconductor processing equipmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →