Inventor · name-matched record
CHIU TZU-WEI
1 granted patent·2 pending applications·0 citations·filing 2022–2024
1Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0159US2026101792A1Method for manufacturing semiconductor stack structure with ultra thin diesNEXTHIN TECH·Filed 2024·Application pending·0 cites
- 0258US2026101686A1Method for manufacturing semiconductor stack structure with ultra thin dieNEXTHIN TECH·Filed 2024·Application pending·0 cites
- 0351US12568856B2Method of manufacturing three-dimensional system-on-chip and three-dimensional system-on-chipCHIU TZU WEI·Filed 2022·Granted Mar 3, 2026·0 cites·9 claims
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Identity basis: exact name match across USPTO filings. How scoring works →