Inventor · name-matched record
CHO KYONGSOON
1 granted patent·3 pending applications·0 citations·filing 2023–2025
8Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0158US12532562B2Semiconductor device including semiconductor chips stacked in a multi-layer structure by a flip-chip bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 20, 2026·0 cites·20 claims
- 0255US2026026119A1Semiconductor package having a stepped molding structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0355US2026026128A1Image sensor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0455US2026075969A1Image sensor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →