Inventor · name-matched record
CHONG CHIN HUI
5 granted patents·8 pending applications·0 citations·filing 2022–2025
58Inventor score
Files withMICRON TECHNOLOGY INC13
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
13 records- 0181US2026026382A1Three dimensional semiconductor trace length matching and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0271US2026032823A1Microelectronic devices including embedded electronic components, and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0368US2026033370A1Systems and methods for reducing trace exposure in stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0464US2026033351A1Stacked die semiconductor package including an array of pillar structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0562US12564096B2Nested semiconductor assemblies and methods for making the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 24, 2026·0 cites·19 claims
- 0660US12588527B2Dielectric interposer with electrical-connection cut-inMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 24, 2026·0 cites·35 claims
- 0759US12593706B2Multi-chip package with enhanced conductive layer adhesionMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 31, 2026·0 cites·17 claims
- 0859US12532781B2Stacked capacitors for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 20, 2026·0 cites·18 claims
- 0959US2026011633A1High die stack package with modular structureMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1059US2026011686A1High die stack package with secondary interposerMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1159US2026011679A1High die stack package with vertical die-to-die interconnectsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1258US2026026359A1Identification marking cavity filling for semiconductor packagesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1355US12525521B2Package substrate for a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 13, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →