Inventor · name-matched record
CHUANG HARRY-HAK-LAY
8 granted patents·4 pending applications·0 citations·filing 2021–2025
73Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
12 records- 0197US2026090280A1Memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0292US2026090083A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0387US12520731B2Memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·20 claims
- 0486US2026079218A1Magnet configuration systems and methods to detect magnetic tunnel junction coercivity weak bits in mram chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0582US12575387B2Method for fabricating a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
- 0674US12543506B2Memory device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
- 0772US12550619B2Techniques for MRAM MTJ top electrode connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0866US12563975B2Magnetic memory device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 24, 2026·0 cites·20 claims
- 0963US12581864B2Memory device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 17, 2026·0 cites·20 claims
- 1059US2026033386A1Semiconductor package component, semiconductor package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1158US12517194B2Magnet configuration systems and methods to detect magnetic tunnel junction coercivity weak bits in MRAM chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 6, 2026·0 cites·20 claims
- 1252US12581865B2Manufacturing method of package with magnetic shielding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 17, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →