Inventor · name-matched record
CHUNG HYUNSOO
4 granted patents·14 pending applications·0 citations·filing 2022–2025
52Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
18 records- 0180US2026083022A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0264US2026101758A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0360US12582009B2Semiconductor package including padsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 17, 2026·0 cites·20 claims
- 0458US2026041002A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0558US2026047483A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0657US12598758B2Semiconductor device including dummy padSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 7, 2026·0 cites·19 claims
- 0757US12525585B2Semiconductor package including sub-packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·20 claims
- 0854US12525586B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·20 claims
- 0954US2026090418A1Semiconductor package including a conductive postSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1053US2026090389A1Semiconductor package and manufacturing method for sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1151US2026068739A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1250US2026101735A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1350US2026047488A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1449US2026040915A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1549US2026026402A1Semiconductor package including logic die alongside buffer die and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1648US2026026404A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1747US2026026403A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1845US2026026369A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →