Inventor · name-matched record
CLEVENGER LAWRENCE A
15 granted patents·1 citations·filing 2020–2024
84Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
15 records- 0192US12538553B2Contact structure for power delivery on semiconductor deviceIBM·Filed 2022·Granted Jan 27, 2026·1 cites·20 claims
- 0287US12550709B2Semiconductor device including a porous dielectric layer, and method of forming the semiconductor deviceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0372US12598970B2Top via on subtractively etched conductive lineINT BUSINESS MACHINES CORPORATION·Filed 2022·Granted Apr 7, 2026·0 cites·13 claims
- 0471US12557298B2Resistive random access memory on a buried bitlineIBM·Filed 2022·Granted Feb 17, 2026·0 cites·20 claims
- 0566US12550713B2Hybrid buried power rail structure with dual front side and backside processingIBM·Filed 2022·Granted Feb 10, 2026·0 cites·18 claims
- 0664US12557328B2Vertical-transport field-effect transistor with backside source/drain connectionsIBM·Filed 2022·Granted Feb 17, 2026·0 cites·19 claims
- 0764US12550704B2Subtractive skip viaIBM·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0864US12550719B2VTFET circuit with optimized outputIBM·Filed 2022·Granted Feb 10, 2026·0 cites·12 claims
- 0962US12550711B2Interconnection fabric for buried power distributionIBM·Filed 2020·Granted Feb 10, 2026·0 cites·12 claims
- 1060US12588280B2Backsides subtractive M1 patterning with backside contact repair for tight N2P spaceIBM·Filed 2023·Granted Mar 24, 2026·0 cites·16 claims
- 1160US12575399B2Interconnect structure including vertically stacked power and ground linesIBM·Filed 2022·Granted Mar 10, 2026·0 cites·18 claims
- 1258US12568645B2Vertical field effect transistor with self-aligned backside trench epitaxyIBM·Filed 2022·Granted Mar 3, 2026·0 cites·16 claims
- 1356US12575400B2Power planes and pass-through viasIBM·Filed 2022·Granted Mar 10, 2026·0 cites·12 claims
- 1455US12598983B2Interconnects formed using integrated damascene and subtractive etch processingINT BUSINESS MACHINES CORPORATION·Filed 2021·Granted Apr 7, 2026·0 cites·20 claims
- 1554US12527068B2Two-dimensional self-aligned backside via-to-backside power rail (VBPR)IBM·Filed 2021·Granted Jan 13, 2026·0 cites·18 claims
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Identity basis: exact name match across USPTO filings. How scoring works →