Inventor · name-matched record

DAI YING

1 granted patent·0 citations·filing 2020–2020

6Inventor score

Technology areasH10W

Files withNANTONG TONGFU MICROELECTRONICS CO LTD1

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

1 record

0145US12564083B2Packaging structure having semiconductor chips and encapsulation layers and formation method thereofNANTONG TONGFU MICROELECTRONICS CO LTD·Filed 2020·Granted Feb 24, 2026·0 cites·20 claims

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Identity basis: exact name match across USPTO filings. How scoring works →