Inventor · name-matched record
DAI YU-TENG
1 granted patent·3 pending applications·0 citations·filing 2023–2024
14Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0176US12532500B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 20, 2026·0 cites·20 claims
- 0262US2026076161A1Conductive interconnection structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0362US2026018459A1Semiconductor structure including isolation elements with etching-resistant upper portions and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0461US2026011601A1Semiconductor device having air gap structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when DAI YU-TENG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →