Inventor · name-matched record
DAVIS ROBIN
0 granted patents·4 pending applications·0 citations·filing 2025–2025
Files withDECA TECH USA INC4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0189US2026068721A13d block attached to a substrate in a semiconductor packageDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0288US2026040919A1Fully molded semiconductor structure with through silicon via (tsv) vertical interconnectsDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0364US2026101777A1Molded layered bridge and method of making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0457US2026011574A1Interconnect substrate and method of makingDECA TECH USA INC·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →