Inventor · name-matched record
DESHPANDE NITIN A
3 granted patents·3 pending applications·0 citations·filing 2021–2025
41Inventor score
Files withINTEL CORP6
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0192US2026099001A1Photonic integrated circuit packaging architectureINTEL CORP·Filed 2025·Application pending·0 cites
- 0284US2026099015A1Photonic integrated circuit packaging architecturesINTEL CORP·Filed 2025·Application pending·0 cites
- 0368US12591092B2Covered cavity for a photonic integrated circuit (PIC)INTEL CORP·Filed 2022·Granted Mar 31, 2026·0 cites·24 claims
- 0464US12525545B2HBI die fiducial architecture with cantilever fiducials for smaller die size and better yieldsINTEL CORP·Filed 2021·Granted Jan 13, 2026·0 cites·19 claims
- 0561US2026090416A1Disaggregated semiconductor chip on interposer without through-substrate viasINTEL CORP·Filed 2024·Application pending·0 cites
- 0657US12599034B2Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposerINTEL CORP·Filed 2022·Granted Apr 7, 2026·0 cites·30 claims
Join the waitlist — get patent alerts
Get an alert when DESHPANDE NITIN A files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →