Inventor · name-matched record
DUAN GANG
7 granted patents·42 pending applications·0 citations·filing 2020–2025
68Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
49 records- 0193US2026026373A1First layer interconnect first on carrier approach for emib patchINTEL CORP·Filed 2025·Application pending·0 cites
- 0276US12568831B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2023·Granted Mar 3, 2026·0 cites·8 claims
- 0367US2026078046A1Plasma-based glass package dicingINTEL CORP·Filed 2024·Application pending·0 cites
- 0466US2026077433A1Apparatus and Methods for Water-Assisted SingulationINTEL CORP·Filed 2024·Application pending·0 cites
- 0563US2026090461A1Socket assemblies for semiconductor device packages with edge featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0662US2026090435A1Selective porous glass for glass substrate singulationINTEL CORP·Filed 2024·Application pending·0 cites
- 0762US2026090434A1Ic packages with substrates having glass cores with large footprints, thin redistribution layers, and electrical componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 0862US2026090410A1Embedded channels in a glass coreINTEL CORP·Filed 2024·Application pending·0 cites
- 0961US2026090431A1Glass etch protection and seware reduction by coating protectionINTEL CORP·Filed 2024·Application pending·0 cites
- 1061US2026005020A1Inorganic reconstitution carrier panelINTEL CORP·Filed 2024·Application pending·0 cites
- 1161US2026005083A1Tooling hole for hybrid panel assemblyINTEL CORP·Filed 2024·Application pending·0 cites
- 1261US2026090430A1Edge coating for glass core substrate with a frameINTEL CORP·Filed 2024·Application pending·0 cites
- 1361US2026090427A1Glass core substrate with edge biasINTEL CORP·Filed 2024·Application pending·0 cites
- 1461US2026005077A1Package substrates with cores having solid glass and glass fiber prepregINTEL CORP·Filed 2024·Application pending·0 cites
- 1561US2026090429A1Edge coating for glass core substrate with air pressing for profile controlINTEL CORP·Filed 2024·Application pending·0 cites
- 1661US2026090424A1Singulation incorporating an etched metal channelINTEL CORP·Filed 2024·Application pending·0 cites
- 1760US2026086114A1Socket assemblies for semiconductor devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 1860US2026076240A1Glass cores with tapered insulator edgesINTEL CORP·Filed 2024·Application pending·0 cites
- 1959US12593695B2Structure and process for warpage reductionINTEL CORP·Filed 2022·Granted Mar 31, 2026·0 cites·20 claims
- 2059US2026096459A1Methods of fabricating hybrid glass core package structures including 3d locking mechanismsINTEL CORP·Filed 2024·Application pending·0 cites
- 2159US2026005079A1Thin glass core panels in circuit device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 2259US2026082969A1Integrated circuit packages including a glass-core substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 2359US2026040982A1Glass package with liquid metal socketingINTEL CORP·Filed 2024·Application pending·0 cites
- 2459US2026005084A1Microelectronic Glass-Containing Core Layer Including Clamp StructureINTEL CORP·Filed 2024·Application pending·0 cites
- 2559US2026005173A1Embedded bridge with protection layer for via formation with bump pitch scalingINTEL CORP·Filed 2024·Application pending·0 cites
- 2659US2026090433A13d printing of glass core edge protection in ic device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 2758US12543578B2Electronic packaging architecture with customized variable metal thickness on same buildup layerINTEL CORP·Filed 2021·Granted Feb 3, 2026·0 cites·18 claims
- 2858US2026082934A1Methods for Providing Semi-transparent Substrate EdgesINTEL CORP·Filed 2024·Application pending·0 cites
- 2958US2026090432A1Methods and systems for forming integrated circuit packages comprising glass layers with thin singulated portionsINTEL CORP·Filed 2024·Application pending·0 cites
- 3058US2026005114A1Frames for glass core hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 3158US2026090426A1Semiconductor core layer including glass sheet having edge protection structure and method of making sameINTEL CORP·Filed 2024·Application pending·0 cites
- 3258US2026082970A1Integrated circuit packages including a glass-core substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 3357US2026005115A1Methods and systems for forming integrated circuit packages comprising glass layersINTEL CORP·Filed 2024·Application pending·0 cites
- 3457US2026005160A1Hybrid panel with a glass substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 3557US2026001297A1Hybrid panel with a glass substrate and plated frameINTEL CORP·Filed 2024·Application pending·0 cites
- 3657US2026090428A1Protection layer for glass substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 3757US2026084181A1Scraper with vacuum line for coating layer profile controlINTEL CORP·Filed 2024·Application pending·0 cites
- 3856US12557594B2Device and method for real-time offset adjustment of a semiconductor die placementINTEL CORP·Filed 2023·Granted Feb 17, 2026·0 cites·17 claims
- 3956US2026005159A1Reconstituted glass panel for hybrid panel manufacturingINTEL CORP·Filed 2024·Application pending·0 cites
- 4056US2026001805A1Hybrid Panel with an Edge Coated Glass PanelINTEL CORP·Filed 2024·Application pending·0 cites
- 4156US2026005078A1Fabricating integrated circuit packages with glass core hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 4256US2026082965A1Microelectronic assemblies including a glass-core with post-singulation edge featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 4355US2026005081A1Hybrid glass and organic substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 4455US2026005042A1System and method for singulation of semiconductor workpieceINTEL CORP·Filed 2024·Application pending·0 cites
- 4555US2026005186A1Semiconductor manufacturing system and methodINTEL CORP·Filed 2024·Application pending·0 cites
- 4655US2026090425A1Semiconductor core layer including glass sheet having edge sealant structure and method of making sameINTEL CORP·Filed 2024·Application pending·0 cites
- 4753US12522737B2Crosslinkable flame-retardant coating compositionSWIMC LLC·Filed 2020·Granted Jan 13, 2026·0 cites·20 claims
- 4851US12525497B2Microelectronic assemblies with adaptive multi-layer encapsulation materialsINTEL CORP·Filed 2021·Granted Jan 13, 2026·0 cites·18 claims
- 4949US12517314B2High bandwidth optical interconnection architecturesINTEL CORP·Filed 2020·Granted Jan 6, 2026·0 cites·17 claims
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Identity basis: exact name match across USPTO filings. How scoring works →