Inventor · name-matched record
ECTON JEREMY
1 granted patent·9 pending applications·0 citations·filing 2020–2024
3Inventor score
Files withINTEL CORP10
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
10 records- 0162US2026090434A1Ic packages with substrates having glass cores with large footprints, thin redistribution layers, and electrical componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 0260US2026076240A1Glass cores with tapered insulator edgesINTEL CORP·Filed 2024·Application pending·0 cites
- 0359US2026096459A1Methods of fabricating hybrid glass core package structures including 3d locking mechanismsINTEL CORP·Filed 2024·Application pending·0 cites
- 0459US2026005079A1Thin glass core panels in circuit device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 0559US2026082969A1Integrated circuit packages including a glass-core substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 0659US2026090433A13d printing of glass core edge protection in ic device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 0758US2026082970A1Integrated circuit packages including a glass-core substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 0856US2026005078A1Fabricating integrated circuit packages with glass core hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 0956US2026082965A1Microelectronic assemblies including a glass-core with post-singulation edge featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1049US12517314B2High bandwidth optical interconnection architecturesINTEL CORP·Filed 2020·Granted Jan 6, 2026·0 cites·17 claims
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Identity basis: exact name match across USPTO filings. How scoring works →