Inventor · name-matched record
ECTON JEREMY D
3 granted patents·15 pending applications·0 citations·filing 2021–2024
40Inventor score
Files withINTEL CORP18
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
18 records- 0162US2026090435A1Selective porous glass for glass substrate singulationINTEL CORP·Filed 2024·Application pending·0 cites
- 0262US2026090410A1Embedded channels in a glass coreINTEL CORP·Filed 2024·Application pending·0 cites
- 0361US12523826B2Photonic integrated circuit to glass substrate alignment through integrated cylindrical lens and waveguide structureINTEL CORP·Filed 2021·Granted Jan 13, 2026·0 cites·21 claims
- 0461US2026005020A1Inorganic reconstitution carrier panelINTEL CORP·Filed 2024·Application pending·0 cites
- 0561US2026005083A1Tooling hole for hybrid panel assemblyINTEL CORP·Filed 2024·Application pending·0 cites
- 0661US2026090430A1Edge coating for glass core substrate with a frameINTEL CORP·Filed 2024·Application pending·0 cites
- 0761US2026090427A1Glass core substrate with edge biasINTEL CORP·Filed 2024·Application pending·0 cites
- 0861US2026005077A1Package substrates with cores having solid glass and glass fiber prepregINTEL CORP·Filed 2024·Application pending·0 cites
- 0961US2026090429A1Edge coating for glass core substrate with air pressing for profile controlINTEL CORP·Filed 2024·Application pending·0 cites
- 1061US2026090424A1Singulation incorporating an etched metal channelINTEL CORP·Filed 2024·Application pending·0 cites
- 1160US2026005125A1Inverted glass interposer with glass stiffenerINTEL CORP·Filed 2024·Application pending·0 cites
- 1260US2026086114A1Socket assemblies for semiconductor devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 1359US2026040982A1Glass package with liquid metal socketingINTEL CORP·Filed 2024·Application pending·0 cites
- 1459US2026005084A1Microelectronic Glass-Containing Core Layer Including Clamp StructureINTEL CORP·Filed 2024·Application pending·0 cites
- 1558US12543578B2Electronic packaging architecture with customized variable metal thickness on same buildup layerINTEL CORP·Filed 2021·Granted Feb 3, 2026·0 cites·18 claims
- 1658US2026090432A1Methods and systems for forming integrated circuit packages comprising glass layers with thin singulated portionsINTEL CORP·Filed 2024·Application pending·0 cites
- 1758US2026005114A1Frames for glass core hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 1855US12575427B2Defect-free through glass via metallization implementing a sacrificial resist thinning materialINTEL CORP·Filed 2021·Granted Mar 10, 2026·0 cites·12 claims
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Identity basis: exact name match across USPTO filings. How scoring works →