Inventor · name-matched record
EID FERAS
11 granted patents·13 pending applications·1 citations·filing 2020–2024
78Inventor score
Files withINTEL CORP24
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
24 records- 0185US12542358B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2023·Granted Feb 3, 2026·0 cites·9 claims
- 0277US12588499B2Integrated circuit heat spreader including sealant interface materialINTEL CORP·Filed 2020·Granted Mar 24, 2026·1 cites·19 claims
- 0364US2026090470A1Photonic stacks for multi-tier photonic integrated circuit package assembliesINTEL CORP·Filed 2024·Application pending·0 cites
- 0463US2026082917A1Integration of self-assembly features with photonic circuitsINTEL CORP·Filed 2024·Application pending·0 cites
- 0562US2026096472A1Extended hybrid bonding with a photonic interfaceINTEL CORP·Filed 2024·Application pending·0 cites
- 0662US2026099012A1Hybrid-bonded ic die having topographic surface featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0761US12532740B2Porous mesh structures for the thermal management of integrated circuit devicesINTEL CORP·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 0861US2026086307A1Optical coupling using shifted out-of-plane light propagationINTEL CORP·Filed 2024·Application pending·0 cites
- 0961US2026093070A1Multi-layer integrated ring resonators and waveguide interconnect stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 1061US2026090452A1Integrated circuit packages including a high thermal conductivity material coupled to a substrate with microchannels in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 1161US2026086279A1Technologies for low-crosstalk multilayer waveguide stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 1261US2026090450A1Integrated circuit packages including a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 1360US12519073B2Conformal power delivery structures of 3D stacked die assembliesINTEL CORP·Filed 2021·Granted Jan 6, 2026·0 cites·20 claims
- 1460US2026090454A1Integrated circuit packages including 3 dimensional die stacks with a die having a sidewall modificationINTEL CORP·Filed 2024·Application pending·0 cites
- 1560US2026090453A1Integrated circuit packages including a structural die coupled to a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 1660US2026090451A1Integrated circuit packages including a heat spreader having a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 1760US2026086308A1Disaggregation and assembly of photonics integrated circuits using photonic viasINTEL CORP·Filed 2024·Application pending·0 cites
- 1859US12538841B2Quasi-monolithic die architecturesINTEL CORP·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 1958US12598989B2Package structures with patterned die backside layerINTEL CORP·Filed 2022·Granted Apr 7, 2026·0 cites·13 claims
- 2058US12581938B2Package architecture for quasi-monolithic chip with backside powerINTEL CORP·Filed 2022·Granted Mar 17, 2026·0 cites·15 claims
- 2156US12532739B2Metal matrix composite layers having graded filler content for heat dissipation from integrated circuit devicesINTEL CORP·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 2256US12520506B2In situ inductor structure in buildup power planesINTEL CORP·Filed 2021·Granted Jan 6, 2026·0 cites·21 claims
- 2355US12550781B2Template structure for quasi-monolithic die architecturesINTEL CORP·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 2453US12550768B2Conformal power delivery structures near high-speed signal tracesINTEL CORP·Filed 2021·Granted Feb 10, 2026·0 cites·24 claims
Join the waitlist — get patent alerts
Get an alert when EID FERAS files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →