Inventor · name-matched record

EITAN AMRAM

1 granted patent·1 pending application·0 citations·filing 2023–2025

4Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD2

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0181US2026082973A1Die bonding tool with tiltable bond head for improved bonding and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0254US12575454B2Bonding structures for semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims

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Identity basis: exact name match across USPTO filings. How scoring works →