Inventor · name-matched record

ERIKE ERIC

0 granted patents·2 pending applications·0 citations·filing 2025–2025

Technology areasH05K H10W

Files withGANGA SIVA PRASAD JANGILI1 INTEL CORP1

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

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2 records

0176US2026047437A1Improved semiconductor chip package thermo-mechanical cooling assemblyINTEL CORP·Filed 2025·Application pending·0 cites
0274US2026074455A1Land grid array (lga) socket pins and housingsGANGA SIVA PRASAD JANGILI·Filed 2025·Application pending·0 cites

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Identity basis: exact name match across USPTO filings. How scoring works →