Inventor · name-matched record
GAO LE
0 granted patents·3 pending applications·0 citations·filing 2024–2024
Files withQUALCOMM INC3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0158US2026082916A1Package-on-package structure including multi-phase cooling structureQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0253US2026018487A1Mold compound embedded device cooling structureQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0352US2026018488A1Integrated circuit device having a two-phase thermal management deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →