Inventor · name-matched record
GOH ENG HUAT
2 granted patents·3 pending applications·0 citations·filing 2021–2024
23Inventor score
Files withINTEL CORP5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0163US2026068174A1Overhang architectures for high bandwidth memory (hbm) multi-die assemblies and methods for making sameINTEL CORP·Filed 2024·Application pending·0 cites
- 0256US12581972B2Electrically conductive strips on a side of a memory moduleINTEL CORP·Filed 2022·Granted Mar 17, 2026·0 cites·25 claims
- 0355US2026096027A1Flexible mounting structures for surface mount componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 0454US12575448B2Integrated circuit packages with on package memory architecturesINTEL CORP·Filed 2021·Granted Mar 10, 2026·0 cites·20 claims
- 0553US2026090466A1Technologies for a stacked integrated circuit packageINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →