Inventor · name-matched record
GOMES WILFRED
16 granted patents·19 pending applications·0 citations·filing 2021–2025
83Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
35 records- 0184US2026026096A1Integrated circuit structures having ultra-high conductivity global routingINTEL CORP·Filed 2025·Application pending·0 cites
- 0268US12567866B2Digital to analog converter using high-injection velocity channel materials for low temperature signal conversionINTEL CORP·Filed 2022·Granted Mar 3, 2026·0 cites·22 claims
- 0367US12520482B2Memory arrays with backside components and angled transistorsINTEL CORP·Filed 2023·Granted Jan 6, 2026·0 cites·20 claims
- 0465US12525295B2Two transistor memory cells with angled transistorsINTEL CORP·Filed 2023·Granted Jan 13, 2026·0 cites·20 claims
- 0565US2026081089A1Backend field emission devicesSHARMA ABHISHEK A·Filed 2024·Application pending·0 cites
- 0664US2026088054A1Tight pitch connectivity for dynamic random access memoryINTEL CORP·Filed 2024·Application pending·0 cites
- 0764US2026090469A1Microelectronic assemblies with tags disintegrated from cache memoryINTEL CORP·Filed 2024·Application pending·0 cites
- 0864US2026076182A1Varied substrate thickness for thermal managementSHARMA ABHISHEK A·Filed 2024·Application pending·0 cites
- 0963US2026082898A1Backend optical interconnectsSHARMA ABHISHEK A·Filed 2024·Application pending·0 cites
- 1063US2026086282A1Gated backend optical interconnectsSHARMA ABHISHEK A·Filed 2024·Application pending·0 cites
- 1162US12563724B2Two transistor memory cells with source-drain coupling in one transistorINTEL CORP·Filed 2022·Granted Feb 24, 2026·0 cites·20 claims
- 1262US2026006800A1Device, method and system to provide heterogeneous memory circuit stackingINTEL CORP·Filed 2024·Application pending·0 cites
- 1362US2026096206A1Inter-nanoribbon connections to enable scaled circuitsINTEL CORP·Filed 2024·Application pending·0 cites
- 1462US2026082829A1Gunn diodes for clock synchronization circuitsSHARMA ABHISHEK A·Filed 2024·Application pending·0 cites
- 1562US2026068697A1Through-assembly conductive vias of varying depthINTEL CORP·Filed 2024·Application pending·0 cites
- 1662US2026068621A1Conductive vias for three dimensional integrationINTEL CORP·Filed 2024·Application pending·0 cites
- 1762US2026005094A1Device, method and system to conduct heat through an active layer of an integrated circuit dieINTEL CORP·Filed 2024·Application pending·0 cites
- 1862US2026068710A1Inter-die connectivity techniques with a bridge die and through-assembly conductive viasINTEL CORP·Filed 2024·Application pending·0 cites
- 1962US2026005131A1Device, method and system to provide electrical coupling across active layers of an integrated circuit dieINTEL CORP·Filed 2024·Application pending·0 cites
- 2062US2026082604A1Low temperature tunnel diode for negative differential resistanceSHARMA ABHISHEK A·Filed 2024·Application pending·0 cites
- 2162US2026006801A1Vertically stacked memory arrays corresponding to respective single dopant typesINTEL CORP·Filed 2024·Application pending·0 cites
- 2261US2026082828A1Gunn diode with layered structureSHARMA ABHISHEK A·Filed 2024·Application pending·0 cites
- 2361US2026082830A1Gunn diodes with doped epitaxial regionsSHARMA ABHISHEK A·Filed 2024·Application pending·0 cites
- 2460US12572299B2Method and apparatus to implement an integrated circuit including both dynamic random-access memory (DRAM) and static random-access memory (SRAM)INTEL CORP·Filed 2022·Granted Mar 10, 2026·0 cites·18 claims
- 2560US12550334B2Memory with one access transistor for multiple hysteretic capacitorsINTEL CORP·Filed 2021·Granted Feb 10, 2026·0 cites·20 claims
- 2659US12562215B2Providing orthogonal subarrays in a dynamic random access memoryINTEL CORP·Filed 2022·Granted Feb 24, 2026·0 cites·20 claims
- 2758US12588189B2Memory devices with vertical transistorsINTEL CORP·Filed 2022·Granted Mar 24, 2026·0 cites·10 claims
- 2858US12543594B2Scalable package architecture using reticle stitching and photonics for integrated circuitsINTEL CORP·Filed 2022·Granted Feb 3, 2026·0 cites·20 claims
- 2958US12527026B2Field-effect transistor with hybrid switching mechanismINTEL CORP·Filed 2022·Granted Jan 13, 2026·0 cites·19 claims
- 3056US12550732B2Single conductivity type devices for low temperature computationINTEL CORP·Filed 2022·Granted Feb 10, 2026·0 cites·22 claims
- 3156US12532480B2Embedded memory with double-walled ferroelectric capacitorsINTEL CORP·Filed 2021·Granted Jan 20, 2026·0 cites·13 claims
- 3255US12575401B2Integrated circuit devices with angled transistors and angled routing tracksINTEL CORP·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
- 3355US12550733B2Multiple epitaxial layer source and drain transistors for low temperature computationINTEL CORP·Filed 2022·Granted Feb 10, 2026·0 cites·23 claims
- 3455US12550381B2Device, method and system to provide epitaxial structures opposite sides of a separation layer between channel stacksINTEL CORP·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 3551US12526985B2Back-side reveal for power delivery to backend memory with frontend transistors and backend memroy cellsINTEL CORP·Filed 2021·Granted Jan 13, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →