Inventor · name-matched record

HABA BELGACEM

8 granted patents·24 pending applications·0 citations·filing 2022–2025

71Inventor score

Technology areasH10W H01L H10B H10H G01R

Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC26 ADEIA SEMICONDUCTOR TECH LLC3 ADEIA SEMICONDUCTOR BONDING TECH INC2 ADEIA SEMICONDUCTOR INC1

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

32 records

0196US2026052693A13d nand - high aspect ratio strings and channelsADEIA SEMICONDUCTOR INC·Filed 2025·Application pending·0 cites
0295US2026072279A1Bonded optical devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
0395US2026082960A1Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
0495US2026083016A1Embedded organic interposer for high bandwidthADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
0594US2026060053A1Metal pads over tsvADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
0692US2026047493A1Stacked devices and methods of fabricationADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
0786US2026060130A1Microelectronic assembliesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
0882US2026041003A1Symbiotic Network On LayersADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
0981US2026053016A1Bonded structure with interconnect structureADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
1080US12564084B2Bonded structures without intervening adhesiveADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Feb 24, 2026·0 cites·38 claims
1180US2026018564A1Capacitive coupling in a direct-bonded interface for microelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
1275US2026018490A1Embedded cooling systems for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
1370US12543568B2Thermoelectric cooling for die packagesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 3, 2026·0 cites·13 claims
1469US2026040750A1Efficient assembly for led displaysADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
1569US2026053023A1Folded high-bandwidth memory systemsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
1668US12591005B2Testing elements for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Mar 31, 2026·0 cites·25 claims
1768US12532432B2Hotspot mitigation in fluid coolingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Jan 20, 2026·0 cites·10 claims
1868US2026020415A1Normal emitting stacked monochromatic wafers for color pixel displays and methods related theretoADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
1968US2026025989A1Anti-fuse devices and methods of forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
2068US2026020407A1Stacked monochromatic wafers with edge emitted leds for color pixel displays and methods related theretoADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
2166US12543577B2Bonded structure with active interposerADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 3, 2026·0 cites·29 claims
2266US12525506B2Embedded cooling systems for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Jan 13, 2026·0 cites·18 claims
2365US2026026310A1Methods and systems for hybrid bonding large substratesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
2464US2026068632A1Backside power delivery attachmentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
2563US2026026013A1Hybrid bonded memory and logic devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
2663US2026052950A1Semiconductor elements with hybrid bonding layersADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
2762US2026050009A1Probe cards and methods related theretoADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
2861US2026033312A1Structures and methods for thermal dissipation in diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
2961US2026033359A1Connecting element for semiconductor devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
3058US12598962B2System and method for bonding transparent conductor substratesADEIA SEMICONDUCTOR BONDING TECH INC·Filed 2023·Granted Apr 7, 2026·0 cites·17 claims
3158US12563749B2Stacked electronic devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 24, 2026·0 cites·22 claims
3257US2026101809A1Encapsulated hybrid bonded structuresADEIA SEMICONDUCTOR BONDING TECH INC·Filed 2024·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when HABA BELGACEM files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: exact name match across USPTO filings. How scoring works →