Inventor · name-matched record
HIRAO AKIRA
3 granted patents·2 pending applications·0 citations·filing 2022–2025
39Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0188US2026014775A1Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 0267US12588564B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Mar 24, 2026·0 cites·18 claims
- 0362US12519047B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·12 claims
- 0461US2026082983A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 0553US12575439B2Semiconductor device including a sealing member to seal a semiconductor chip, a printed circuit board, and a conductive blockFUJI ELECTRIC CO LTD·Filed 2022·Granted Mar 10, 2026·0 cites·12 claims
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Identity basis: exact name match across USPTO filings. How scoring works →