Inventor · name-matched record
HIYAMA SHIN
0 granted patents·2 pending applications·0 citations·filing 2025–2025
Technology areasH10P
Files withKOKUSAI ELECTRIC CORP2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0195US2026081115A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0262US2026002742A1Cooling System, Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when HIYAMA SHIN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →