Inventor · name-matched record

HO CHENG-LIN

1 granted patent·1 pending application·0 citations·filing 2020–2024

7Inventor score

Technology areasH01Q H10P

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0163US2026082918A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
0254US12538817B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 27, 2026·0 cites·16 claims

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Identity basis: exact name match across USPTO filings. How scoring works →