Inventor · name-matched record
HOFFMAN PAUL R
1 granted patent·3 pending applications·0 citations·filing 2025–2025
3Inventor score
Technology areasH10W
Files withDECA TECH USA INC4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0189US2026068721A13d block attached to a substrate in a semiconductor packageDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0264US2026101777A1Molded layered bridge and method of making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0357US2026011574A1Interconnect substrate and method of makingDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0456US12593703B2Molded bridge with vertical interconnects and method of making the sameDECA TECH USA INC·Filed 2025·Granted Mar 31, 2026·0 cites·21 claims
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Identity basis: exact name match across USPTO filings. How scoring works →