Inventor · name-matched record
HONG YANG
2 granted patents·22 citations·filing 2002–2024
53Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0173US6566761B1Electronic device package with high speed signal interconnect between die pad and external substrate padAPPLIED MICRO CIRCUITS CORP·Filed 2002·Granted May 20, 2003·22 cites·21 claims
- 0260US12527368B2Personal cooling garment and cooling deviceUNIV HONG KONG POLYTECHNIC·Filed 2024·Granted Jan 20, 2026·0 cites·22 claims
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Identity basis: exact name match across USPTO filings. How scoring works →