Inventor · name-matched record

HSIAO HAU-YI

1 granted patent·1 pending application·0 citations·filing 2022–2025

5Inventor score

Technology areasH10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD2

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0184US2026082979A1Composite particulates for use as part of a supporting fill mixture in a semicondutor substrate stacking applicationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0257US12519020B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims

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Identity basis: exact name match across USPTO filings. How scoring works →