Inventor · name-matched record
HSIEH MENG-WEI
1 granted patent·2 pending applications·0 citations·filing 2022–2025
8Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0182US2026068685A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0281US2026076238A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0357US12562454B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 24, 2026·0 cites·12 claims
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Identity basis: exact name match across USPTO filings. How scoring works →