Inventor · name-matched record
HSIEH YI-LING
2 granted patents·1 pending application·0 citations·filing 2024–2025
21Inventor score
Files withCHIPBOND TECHNOLOGY CORP3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0164US2026020137A1Heat dissipation sheet, circuit board, and electronic deviceCHIPBOND TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0249US12564056B2Inner lead structure of flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2024·Granted Feb 24, 2026·0 cites·13 claims
- 0347US12550764B2Layout structure of flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2024·Granted Feb 10, 2026·0 cites·10 claims
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Identity basis: exact name match across USPTO filings. How scoring works →