Inventor · name-matched record

HSIEH YU-TE

1 granted patent·1 pending application·0 citations·filing 2022–2024

11Inventor score

Technology areasH10W

Files withSEMICONDUCTOR COMPONENTS IND LLC1 TONG HSING ELECTRONIC INDUSTRIES LTD1

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0165US12532559B2Image sensor packaging structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
0258US2026047480A1Power chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites

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Identity basis: exact name match across USPTO filings. How scoring works →