Inventor · name-matched record

HSU CHIA-KUEI

2 granted patents·3 pending applications·0 citations·filing 2022–2025

30Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD5

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

5 records

0195US2026076184A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0294US2026011622A1High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0391US2026090423A1Semiconductor Package and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0484US12550792B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
0570US12519067B2Two-piece type stiffener structure with beveled surface for delamination reduction and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims

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Identity basis: exact name match across USPTO filings. How scoring works →