Inventor · name-matched record
HSU WEN-SUNG
2 granted patents·1 pending application·0 citations·filing 2021–2024
25Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0165US12557215B2Semiconductor package using flip-chip technologyMEDIATEK INC·Filed 2021·Granted Feb 17, 2026·0 cites·18 claims
- 0259US12588522B2Semiconductor package structureMEDIATEK INC·Filed 2023·Granted Mar 24, 2026·0 cites·19 claims
- 0350US2026082508A1Liquid cooling heat dissipation device for electronic/computer productsHSU YU JUI·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →