Inventor · name-matched record
HU CHIEH
1 granted patent·1 pending application·0 citations·filing 2020–2025
13Inventor score
Technology areasH10P
Files withGLOBALWAFERS CO LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0159US2026015766A1Reaction apparatus and methods for depositing an epitaxial layer on a semiconductor structure with side injectionGLOBALWAFERS CO LTD·Filed 2025·Application pending·0 cites
- 0253US12581571B2System and methods for a radiant heat cap in a semiconductor wafer reactorGLOBALWAFERS CO LTD·Filed 2020·Granted Mar 17, 2026·0 cites·8 claims
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Identity basis: exact name match across USPTO filings. How scoring works →