Inventor · name-matched record
HUANG HUNG-YI
4 granted patents·1 pending application·0 citations·filing 2022–2025
57Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0188US12557568B2Conductive feature formation and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 17, 2026·0 cites·20 claims
- 0280US2026076164A1Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0372US12588268B2Liner-free conductive structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
- 0469US12538771B2Barrier layer for an interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 0560US12535853B2Electronic deviceHUAWEI TECH CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when HUANG HUNG-YI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →