Inventor · name-matched record
HUANG SHAOWU
1 granted patent·7 pending applications·0 citations·filing 2024–2025
14Inventor score
Files withINFINEON TECHNOLOGIES AMERICAS CORP5ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC1ADEIA SEMICONDUCTOR INC1ADEIA SEMICONDUCTOR TECH LLC1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0195US2026082960A1Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0288US12557659B2Wire bonding method and apparatus for electromagnetic interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Feb 17, 2026·0 cites·20 claims
- 0386US2026060048A1Direct-bonded native interconnects and active base dieADEIA SEMICONDUCTOR INC·Filed 2025·Application pending·0 cites
- 0471US2026067002A1Reducing adverse effects of electromagnetic interference in a vehicleINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2025·Application pending·0 cites
- 0571US2026066945A1In-band emission mitigation for in-vehicle communication networksINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2025·Application pending·0 cites
- 0670US2026066153A1Shielded cable channel electromagnetic compatibility improvement using absorbersINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2025·Application pending·0 cites
- 0764US2026082959A1Bandwidth for wirebond integrated circuit packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2025·Application pending·0 cites
- 0863US2026068680A1Electromagnetic compatibility robustness of die-to-die interconnectsINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →