Inventor · name-matched record
HUANG SUI CHI
0 granted patents·4 pending applications·0 citations·filing 2025–2025
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0193US2026096489A1Mitigating thermal impacts on adjacent stacked semiconductor devicesLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 0269US2026040582A1Memory die bonding in stacked semiconductor systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0361US2026041005A1Hybrid bonding techniques for stacked semiconductor systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0456US2026096487A1Semiconductor die stacks using direct bondsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →