Inventor · name-matched record
HUANG WEN-HUNG
7 granted patents·4 pending applications·0 citations·filing 2022–2025
68Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0184US2026068706A1Semiconductor substrate, semiconductor package, method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0276US2026101770A1Ubm-free metal skeleton frame with support studs and method for fabrication thereofNXP B V·Filed 2025·Application pending·0 cites
- 0371US12593496B2Multiple threshold voltage implementation through lanthanum incorporationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·20 claims
- 0468US12557709B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 17, 2026·0 cites·16 claims
- 0567US12575172B2Metal gate electrode formation of memory devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 10, 2026·0 cites·20 claims
- 0659US12588538B2Semiconductor device having wired under bump structure and method thereforNXP BV·Filed 2023·Granted Mar 24, 2026·0 cites·18 claims
- 0758US12538844B2Double-sided multichip packagesNXP USA INC·Filed 2022·Granted Jan 27, 2026·0 cites·24 claims
- 0857US12588557B2Multichip packages with 3D integrationNXP USA INC·Filed 2022·Granted Mar 24, 2026·0 cites·17 claims
- 0957US2026076266A1Semiconductor device with interposer and method thereforNXP BV·Filed 2024·Application pending·0 cites
- 1054US12538571B2Transistor gate structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·19 claims
- 1152US2026090333A1Semiconductor device and method of communication by semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →