Inventor · name-matched record
HUNG LI-CHUN
3 granted patents·8 pending applications·0 citations·filing 2023–2025
38Inventor score
Files withTONG HSING ELECTRONIC INDUSTRIES LTD9TAIWAN SEMICONDUCTOR MFG CO LTD1TONG HSING ELECTRONIC IND LTD1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0186US2026068340A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2025·Application pending·0 cites
- 0286US2026068339A1Sensor package structure and chip-scale sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2025·Application pending·0 cites
- 0370US2026077348A1Package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0467US2026064020A1Euv mask particle removing methods and systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0562US2026052793A1Chip packaging structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0662US2026006924A1Method for manufacturing image sensing device and image sensing deviceTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0760US12575204B2Sensor package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Granted Mar 10, 2026·0 cites·20 claims
- 0860US2026053032A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0960US2026047219A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1054US12598821B2Chip package structure and method for producing the sameTONG HSING ELECTRONIC IND LTD·Filed 2023·Granted Apr 7, 2026·0 cites·13 claims
- 1154US12538598B2Chip package structure and method for fabricating the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Jan 27, 2026·0 cites·15 claims
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Identity basis: exact name match across USPTO filings. How scoring works →