Inventor · name-matched record
HUNG WENSEN
3 granted patents·4 pending applications·0 citations·filing 2021–2024
46Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0184US12550775B2Semiconductor package with stiffener structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0271US12550729B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 10, 2026·0 cites·20 claims
- 0364US2026082941A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0463US2026068671A1Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0561US12538835B2Integrated chip package including a crack-resistant lid structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 0661US2026068745A1Package structure including a package lid with a bottom lid portion and top lid portion and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0757US2026005100A1Semiconductor package with hotspot controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →