Inventor · name-matched record
HWANG JIHWAN
1 granted patent·1 pending application·0 citations·filing 2023–2025
5Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0159US12568837B2Semiconductor chip, semiconductor package including the same, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·20 claims
- 0252US2026101794A1Semiconductor manufacturing apparatus and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →