Inventor · name-matched record
HWANG JUNSIK
8 granted patents·6 pending applications·0 citations·filing 2021–2025
71Inventor score
Files withSAMSUNG ELECTRONICS CO LTD14
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
14 records- 0190US2026083020A1Color conversion structure, display apparatus, and method of manufacturing the display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0289US2026013272A1Semiconductor structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0375US2026012104A1Power conversion system and power conversion methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0472US12519089B2Color conversion structure including quantum dot layer, display apparatus including the color conversion structure, and method of manufacturing display apparatus including the color conversion structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·25 claims
- 0572US2026101610A1Light-emitting device, display apparatus including the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0670US12568861B2Micro semiconductor chip transfer substrate and method of manufacturing display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 3, 2026·0 cites·15 claims
- 0769US12557449B2Display apparatus and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 17, 2026·0 cites·13 claims
- 0862US12563870B2Micro light emitting device and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 24, 2026·0 cites·21 claims
- 0962US12525583B2Micro semiconductor chip transfer substrate, display transferring structure, display device, and method of manufacturing the display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·19 claims
- 1061US2026012145A1Power amplifier and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1160US2026082744A1Transfer substrate, method of manufacturing the transfer substrate, and wet transfer method for semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1258US12581999B2Semiconductor light emitting device, display apparatus including the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 17, 2026·0 cites·30 claims
- 1356US12581769B2Chip wet transfer apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 17, 2026·0 cites·19 claims
- 1456US12520629B2Light-emitting device and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·22 claims
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Identity basis: exact name match across USPTO filings. How scoring works →