Inventor · name-matched record
IM SEUNGWON
4 granted patents·5 pending applications·0 citations·filing 2022–2025
54Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC9
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
9 records- 0189US2026074448A1Transfer molded power modules and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0289US2026068033A1Semiconductor modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0388US2026011683A1Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0470USD1113776SPower module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Granted Feb 17, 2026·0 cites·1 claims
- 0563US2026090482A1Power module packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0661US2026052989A1Mechanisms for dual coupling a semiconductor package assembly to a componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0757US12593736B2Power module package with stacked direct bonded metal substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Mar 31, 2026·0 cites·19 claims
- 0855US12550263B2Switching oscillation reduction for power semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0954US12550754B2Current sharing mismatch reduction in power semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →