Inventor · name-matched record
INGERLY DOUG B
0 granted patents·3 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withINTEL CORP3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0162US2026068697A1Through-assembly conductive vias of varying depthINTEL CORP·Filed 2024·Application pending·0 cites
- 0262US2026068621A1Conductive vias for three dimensional integrationINTEL CORP·Filed 2024·Application pending·0 cites
- 0362US2026068710A1Inter-die connectivity techniques with a bridge die and through-assembly conductive viasINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →