Inventor · name-matched record
ITO YUKI
7 granted patents·5 pending applications·0 citations·filing 2021–2025
67Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES2KIOXIA CORP1LAIR LIQUIDE SA POUR LETUDE ET LEXPLOITATION DES PROCEDES GEORGES CLAUDE1MITSUBISHI MAT CORPORATION1MITSUBISHI MATERIALS CORP1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
12 records- 0184US2026066600A1Conductor wire connection method, half-stripping jig, connection device, and electronic devicePROTERIAL LTD·Filed 2025·Application pending·0 cites
- 0282US2026025117A1Method for manufacturing bonded bodyNGK INSULATORS LTD·Filed 2025·Application pending·0 cites
- 0373US2026018863A1Photonic-crystal surface emitting laser and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2025·Application pending·0 cites
- 0470US12567528B2Contactless power feed apparatus and power transmission coilOMRON TATEISI ELECTRONICS CO·Filed 2023·Granted Mar 3, 2026·0 cites·5 claims
- 0564US12538495B2Semiconductor device, capacitor, and manufacturing method thereofSEMICONDUCTOR ENERGY LAB·Filed 2021·Granted Jan 27, 2026·0 cites·19 claims
- 0664US2026018862A1Photonic-crystal surface emitting laser and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2023·Application pending·0 cites
- 0762US12520503B2Variable resistance non-volatile memoryKIOXIA CORP·Filed 2023·Granted Jan 6, 2026·0 cites·20 claims
- 0861US12569887B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2024·Granted Mar 10, 2026·0 cites·17 claims
- 0958US12597534B2Copper strip for edgewise bending, component for electric or electronic device, and bus barMITSUBISHI MAT CORPORATION·Filed 2022·Granted Apr 7, 2026·0 cites·13 claims
- 1053US12595556B2Molybdenum imido alkyl/allyl complexes for deposition of molybdenum-containing filmsLAIR LIQUIDE SA POUR LETUDE ET LEXPLOITATION DES PROCEDES GEORGES CLAUDE·Filed 2023·Granted Apr 7, 2026·0 cites·17 claims
- 1152US2026081050A1Copper alloy, plastic worked copper alloy material, component for electronic/electrical devices, terminal, bus bar, lead frame and heat dissipation substrateMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 1251US12585103B2Image capturing unit and endoscopeOLYMPUS MEDICAL SYSTEMS CORP·Filed 2024·Granted Mar 24, 2026·0 cites·10 claims
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Identity basis: exact name match across USPTO filings. How scoring works →