Inventor · name-matched record
JAIN PADAM
2 granted patents·2 pending applications·0 citations·filing 2022–2024
25Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0172US12588510B2Weight optimized stiffener and sealing structure for direct liquid cooled modulesGOOGLE LLC·Filed 2023·Granted Mar 24, 2026·0 cites·10 claims
- 0259US2026076228A1Pre-fabricated pin-based vertical electrical connectivity in a package substrateNVIDIA CORP·Filed 2024·Application pending·0 cites
- 0358US2026052986A1Diamond-based integrated circuit package lidNVIDIA CORP·Filed 2024·Application pending·0 cites
- 0455US12568821B2Pin fin placement assembly for forming temperature control element utilized in device die packagesGOOGLE LLC·Filed 2022·Granted Mar 3, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →