Inventor · name-matched record
JENG SHIN-PUU
13 granted patents·11 pending applications·1 citations·filing 2021–2025
83Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
24 records- 0197US2026076227A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0297US2026076124A1Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0395US2026076184A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0494US2026011622A1High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0593US12550757B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·1 cites·20 claims
- 0691US2026076205A1Methods of forming a semiconductor package including stress buffersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0791US2026090423A1Semiconductor Package and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0886US12568824B2Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 3, 2026·0 cites·20 claims
- 0984US12550770B2Embedded stress absorber in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 1084US12550792B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 1184US2026076206A1Package structure with a plurality of corner openings comprising different shapesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1282US12564076B2Chip package with fan-out feature and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
- 1381US12557656B2Stacking via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 1481US2026076233A1Improved integrated passive device dies and methods of forming and placement of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1578US12538852B2Package structure containing chip structure with inclined sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 1678US2026082936A1Dicing process in packages comprising organic interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1777US12568820B2Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·20 claims
- 1877US2026026394A1Package and Method for Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1972US12557645B2Semiconductor packages with thermal lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 17, 2026·0 cites·20 claims
- 2072US12538819B2Inductor RF isolation structure in an interposer and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 2170US12519067B2Two-piece type stiffener structure with beveled surface for delamination reduction and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 2268US2026082922A1Semiconductor device including stress control layer and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2367US12532771B2Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 2464US12519066B2Package structure with a plurality of corner openings comprising different shapes and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 6, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →