Inventor · name-matched record
JEON TAEJUN
1 granted patent·5 pending applications·0 citations·filing 2023–2025
6Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0179US2026040979A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0259US2026082592A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0355US12550739B2Semiconductor package including a metal plate and package-on-package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0447US2026040992A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0546US2026083007A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0636US2026011575A1Method of manufacturing semiconductor package and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →